Enabling Digital Transformation of Products and Services

Quest Global at CES 2023

Booth #11015 | North Hall, LVCC

Jan 5 – 8,  Las Vegas


The demand for ultra-low power, smaller form factor connectivity, AI, and security chipsets is witnessing an unprecedented increase due to the increased adoption of cutting-edge devices. Performance & reliability are the key parameters.


Semiconductor and system companies partner with Quest Global for end-to-end design services. Such partnerships help augment the customer’s engineering teams to support the complex challenges of product design lifecycles and meet stringent time-to-market demands. Quest Global currently supports designs as small as 3nm, and 60% of our silicon engineers work on 7/6/5/4/3 nm technology nodes. In the last five years, we have supported 300+ custom SoC tape-outs delivering customer-specific requirements.

VLSI Engineering

  • RTL Design & Integration
  • Design Verification
  • Physical Design
  • DFT
  • FPGA/ASIC Emulation
  • Analog and Mixed Signal designs

Platform Engineering

  • Firmware, BSP, and Device driver
  • OS Customization and Porting
  • Design & Development of HW & SW platforms – RDK, SDK
  • Testing, V&V services, and Test Automation

Semiconductor​ Solution Demonstrations at CES 2023

A Silicon to Systems to Cloud Partner

  • Silicon Engineering, VLSI & System Design
  • Electronics, Embedded  & Applications
  • Domain knowledge & technology skills to enable the digital transformation of products and services
  • Industry-focused, end-to-end solutions including cloud

An Arm Approved Design Partner

  • A testament to the organization’s prowess in silicon design engineering
  • Providing complete turnkey services from ‘Concept to Silicon’
  • Custom SOC and ASIC

Autonomous Platform for ADAS

  • The solution enables Surround View & Driver Drowsiness Detection
  • Leveraging Renesas Partner Platform

Meet With Us