Booth #11015 | North Hall, LVCC
Jan 5 – 8, Las Vegas
The demand for ultra-low power, smaller form factor connectivity, AI, and security chipsets is witnessing an unprecedented increase due to the increased adoption of cutting-edge devices. Performance & reliability are the key parameters.
Semiconductor and system companies partner with Quest Global for end-to-end design services. Such partnerships help augment the customer’s engineering teams to support the complex challenges of product design lifecycles and meet stringent time-to-market demands. Quest Global currently supports designs as small as 3nm, and 60% of our silicon engineers work on 7/6/5/4/3 nm technology nodes. In the last five years, we have supported 300+ custom SoC tape-outs delivering customer-specific requirements.