Strength & Impact

Industrial Equipment’s

Pack perfectly

Learn how we helped a customer to test validity of using complex thermal resistance networks (CTM’s) in board level applications compared to fully detailed models (FDM’s).

Electronic Packaging for CPGA & BGA Packages

Challenge

Test the validity of using complex thermal resistance networks (CTM’s) in board level applications compared to fully detailed models (FDM’s)

Approach

Created CTMs of electronic packages using results of a fully detailed model Built board level models using both FDMs and CTMs to represent electronic package Ran comparisons including CFD with upstream heating

Impact

Validated approach of using CTMs in multiple boards & system level applications